Technical Presentation on Automating DFT Intelligence: Addressing TCPF Hotspots at the Source Through Design-Aware Test Points in SystemRDL-to-RTL Generators
At DAC 2026, Agnisys will demonstrate IDS-AI™, IDS-NoC™, and Advanced DFT Automation to accelerate chip design, enhance quality, and speed up SoC development.
“We're merging the reliability of deterministic automation with the capabilities of AI to help semiconductor firms create chips faster while maintaining correctness.”— Anupam Bakshi, Founder and CEO of Agnisys, Inc.GARLAND, TX, UNITED STATES, July 22, 2026 /EINPresswire.com/ — Agnisys, Inc., the premier provider of intelligent specification automation solutions for semiconductor design and verification, announced today that it will unveil its newest breakthroughs—including IDS-AI™, IDS-NoC™, and advanced Design-for-Test (DFT) automation—at the 63rd Design Automation Conference (DAC 2026), taking place July 27–29 in Long Beach, CA.
As chip designs become increasingly complex due to AI workloads, chiplet architectures, and safety-critical applications, Agnisys meets these demands with a cohesive automation platform spanning specification, design generation, verification, testability, validation, and documentation.
IDS-AI: From Specification to Sign-Off, Much Faster
Agnisys will present IDS-AI, an agentic AI framework that interprets semiconductor design intent and drives the entire development process from golden specification creation through RTL sign-off. It automates specification creation, RTL generation, and verification within a single connected workflow, enabling teams to detect defects earlier and achieve sign-off more quickly with correct-by-construction precision.
IDS-NoC: Scalable Network-on-Chip Automation
Agnisys will also feature IDS-NoC, which automates the generation of scalable, deadlock-free Network-on-Chip fabrics for AI accelerators, automotive platforms, and multi-core SoCs. Teams can produce complete, open SystemVerilog RTL fabrics instead of manually constructing routers and interfaces, speeding integration and time-to-market.
Advanced DFT Automation: Testability Embedded in the Design Flow
At DAC 2026, Agnisys will present new DFT automation research, introducing Design-Aware Test Points (DATP) integrated directly into the SystemRDL-to-RTL flow. Early adopters have observed up to 4× improvement in Test Coverage Per Flip-Flop (TCPF) and a 50% reduction in top-level ATPG patterns. This session will be delivered by Veerabhadrarao Vasa and Rajesh Gottumukkala of Google, along with Freddy Nunez of Agnisys, on July 28, 2026, in Seaside Room 7.
Our AI-driven solutions deliver predictable, correct-by-construction outcomes while substantially lowering token costs. Whether you're a startup building the next breakthrough AI chip or an established semiconductor company tackling increasingly complex SoCs, or overuse of AI tokens, we'd love to discuss how deterministic AI can accelerate your design and verification flow.
Visit Agnisys at Booth #1557
Engineering leaders, architects, verification engineers, and SoC designers are invited to Booth #1557 during DAC 2026 for live demonstrations and to meet with Agnisys experts. To schedule a meeting or learn more, contact marcom@agnisys.com or visit agnisys.com/agnisys-at-dac-2026.
Upcoming Webinar
Following DAC 2026, Agnisys will host an exclusive technical webinar, “AI-Based CSR Signoff Verification for Faster SoC Development,” on August 20, 2026.
The webinar will demonstrate how AI-driven automation enables engineering teams to verify CSR implementations faster, improve verification quality, eliminate manual signoff processes, and accelerate SoC development from specification to silicon. Additional registration details will be available on the Agnisys website.
About Agnisys
Agnisys is the leading provider of intelligent specification automation solutions for semiconductor development. With two decades of expertise, its IDesignSpec™ Suite takes teams from specification to sign-off, and solutions built on it, including IDS-AI™ and IDS-NoC™, combine correct-by-construction automation with agentic AI to transform executable specifications into automated design, verification, DFT, and documentation deliverables. Agnisys products improve productivity, quality, and time-to-market for SoC, ASIC, FPGA, IP, and AI-driven chip development worldwide.
Tom Anderson
Agnisys, Inc.
marcom@agnisys.com
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